69-11-42339-T777
69-11-42339-T777
Manufacturer : Parker Chomerics
Series : THERMFLOW® T777
Part Status : Active
Usage : -
Type : Gap Filler Pad, Sheet
Shape : Square
Outline : 28.00mm x 28.00mm
Thickness : 0.0045" (0.115mm)
Material : Polymer Solder Hybrid
Adhesive : Tacky - Both Sides
Backing, Carrier : -
Color : Gray
Thermal Resistivity : -
Thermal Conductivity : -
Availability: 100 in stock
New Original Stock
Competitive Prices
One-stop
Customer Service
