RF360 - A Qualcomm-TDK joint venture
- We offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
Image
Part Number
Manufacturer
Description
Unit Price
In Stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : B8605
Part Status : Last Time Buy
Frequency Bands (Low / High) : 880MHz ~ 915MHz / 925MHz ~ 960MHz
Low Band Attenuation (min / max dB) : 45.00dB / 58.00dB
High Band Attenuation (min / max dB) : 44.00dB / 50.00dB
Return Loss (Low Band / High Band) : -
Mounting Type : Surface Mount
Package / Case : 9-SMD, No Lead
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Last Time Buy
Frequency Bands (Low / High) : -
Low Band Attenuation (min / max dB) : -
High Band Attenuation (min / max dB) : -
Return Loss (Low Band / High Band) : -
Mounting Type : -
Package / Case : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Active
Frequency Bands (Low / High) : -
Low Band Attenuation (min / max dB) : -
High Band Attenuation (min / max dB) : -
Return Loss (Low Band / High Band) : -
Mounting Type : -
Package / Case : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Active
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
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