RF360 - A Qualcomm-TDK joint venture
- We offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
Image
Part Number
Manufacturer
Description
Unit Price
In Stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency Bands (Low / High) : -
Low Band Attenuation (min / max dB) : -
High Band Attenuation (min / max dB) : -
Return Loss (Low Band / High Band) : -
Mounting Type : Surface Mount
Package / Case : 8-SMD, No Lead
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency Bands (Low / High) : -
Low Band Attenuation (min / max dB) : -
High Band Attenuation (min / max dB) : -
Return Loss (Low Band / High Band) : -
Mounting Type : Surface Mount
Package / Case : 8-SMD, No Lead
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency Bands (Low / High) : -
Low Band Attenuation (min / max dB) : -
High Band Attenuation (min / max dB) : -
Return Loss (Low Band / High Band) : -
Mounting Type : Surface Mount
Package / Case : 8-SMD, No Lead
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 881.5/942.5MHz
Bandwidth : 25MHz
Insertion Loss : 1.8dB
Ratings : AEC-Q200
Applications : Cellular, GSM
Mounting Type : Surface Mount
Package / Case : 10-SMD, No Lead
Height (Max) : 0.039" (0.98mm)
Size / Dimension : 0.118" L x 0.098" W (3.00mm x 2.50mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : -
Part Status : Obsolete
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 940MHz
Bandwidth : -
Insertion Loss : 2.5dB
Ratings : -
Applications : HiperLAN
Mounting Type : Surface Mount
Package / Case : 8-SMD, No Lead
Height (Max) : 0.043" (1.10mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 942.5MHz
Bandwidth : 35MHz
Insertion Loss : 2.8dB
Ratings : -
Applications : Cell Phone
Mounting Type : Surface Mount
Package / Case : 6-SMD, No Lead
Height (Max) : 0.043" (1.10mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 942.5MHz
Bandwidth : 35MHz
Insertion Loss : 3.2dB
Ratings : -
Applications : Cellular, GSM
Mounting Type : Surface Mount
Package / Case : 6-SMD, No Lead
Height (Max) : 0.043" (1.10mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 938MHz
Bandwidth : 6MHz
Insertion Loss : 2.1dB
Ratings : -
Applications : iDEN Systems
Mounting Type : Surface Mount
Package / Case : 6-SMD, No Lead
Height (Max) : 0.043" (1.10mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Obsolete
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Obsolete
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
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