RF360 - A Qualcomm-TDK joint venture
- We offer a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe, for applications including wireless, automotive and industrial.
Image
Part Number
Manufacturer
Description
Unit Price
In Stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Obsolete
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Last Time Buy
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : General Purpose
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 902.875MHz
Bandwidth : 240kHz
Insertion Loss : 3dB
Ratings : AEC-Q200
Applications : Remote Control
Mounting Type : Surface Mount
Package / Case : 8-SMD, No Lead
Height (Max) : 0.059" (1.50mm)
Size / Dimension : 0.150" L x 0.150" W (3.80mm x 3.80mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : Tape & Reel (TR)
Series : -
Part Status : Obsolete
Frequency - Center : 899MHz
Bandwidth : 6MHz
Insertion Loss : 2.4dB
Ratings : -
Applications : iDEN Systems
Mounting Type : Surface Mount
Package / Case : 6-SMD, No Lead
Height (Max) : 0.043" (1.10mm)
Size / Dimension : 0.118" L x 0.118" W (3.00mm x 3.00mm)
0
100 in stock
Epcos / RF360
Manufacturer : Qualcomm (RF360 - A Qualcomm & TDK Joint Venture)
Packaging : -
Series : *
Part Status : Obsolete
Frequency - Center : -
Bandwidth : -
Insertion Loss : -
Ratings : -
Applications : -
Mounting Type : -
Package / Case : -
Height (Max) : -
Size / Dimension : -
0
100 in stock
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