HF115AC-0.0055-AC-90
HF115AC-0.0055-AC-90
Manufacturer : Bergquist
Series : Hi-Flow® 115-AC
Part Status : Active
Usage : TO-218, TO-220, TO-247
Type : Pad, Sheet
Shape : Rectangular
Outline : 21.84mm x 18.79mm
Thickness : 0.0055" (0.140mm)
Material : Phase Change Compound
Adhesive : Adhesive - One Side
Backing, Carrier : Fiberglass
Color : Gray
Thermal Resistivity : 0.35°C/W
Thermal Conductivity : 0.8 W/m-K
Availability: 100 in stock
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